WP55DK / WP56MS Series

0.3 mm ultra-low-profile board-to-board connector with a mated height of just 0.7 mm. Sets the industry benchmark for miniaturization in compact mobile and IoT devices demanding the thinnest possible interconnect solution.

Request Pricing Download Datasheet View on JAE.com

Key Features

0.3 mm pitch — industry-leading miniaturization
0.7 mm ultra-low mated height
Optimized for thin smartphones and IoT
Stacking heights from 0.7 mm
High signal integrity at fine pitch

Specifications

Pitch

0.3 mm

Mated height

0.7 mm

Current rating

0.15 A per contact

Industries Served

Consumer ElectronicsTelecommunicationsMedical

Related Connectors

WP7 Series

Ultra-miniature 0.4 mm pitch board-to-board connector with a low profile of 0.9–4.0 mm. Designed for space-constrained smartphones, wearables, and portable devices requiring reliable fine-pitch interconnection.

WP10 Series

High-current 10 A board-to-board connector in a compact 0.5 mm pitch format. Ideal for battery management systems, power modules, and high-power portable devices where current capacity and small footprint are both critical.

WP27D Series

Ultra-fine 0.35 mm pitch board-to-board connector offering the smallest footprint in JAE's WP family. Engineered for next-generation smartphones and compact medical wearables where PCB real estate is at an absolute premium.

Interested in this connector?

Contact our Israeli team for pricing, availability, and technical support.

Get in Touch

Type

Board-to-Board Connectors

Manufacturer

Japan Aviation Electronics Industry, Ltd.

Israeli Rep

RSTECH Electronics Ltd

Official Product Page Download Datasheet PDF

All JAE Connectors JAE Overview