Engineers today face increasing challenges when designing and manufacturing electronic devices for consumer or business-to-business markets. As operating frequencies increase and devices become more complex, they may be more susceptible to electromagnetic interference (EMI). EMI shields are commonly implemented in a design to isolate one component or section of a device from another. To ensure a reliable and robust electrical seal, an EMI shielding gasket is often incorporated between the shield housing and the mating surface of the device.
At Gore, we have leveraged our materials expertise to create a portfolio of EMI shielding and grounding gasket solutions to meet a wide range of application needs and address the challenges designers face.
Gore offers a wide range of EMI shielding and grounding gasket solutions that feature a variety of material types and application forms that range from highly customized precision die-cut solutions to standardized off-the-shelf solutions.
The soft conductive foam construction of the GS8000 Series of GORE® EMI Shielding Materials accommodates surface variations in covers and printed circuit boards, alleviating the need to specify very tight tolerances. This soft construction also makes the GS8000 Series compatible with plastic housings and snap fasteners.
GORE® SMT EMI Gaskets and Grounding Pads combine unsurpassed conductivity with the convenience of SMT-compatible format. These conformable components are engineered to maintain consistent contact and low DC resistance. Unlike the traditional designs of pogo pins and universal clips that can easily break, the robust design of GORE® SMT EMI Gaskets and Grounding Pads increase durability with large contact surfaces rather than single-point contacts. The unique construction of GORE® SMT EMI Gaskets and Grounding Pads ensures that the device maintains signal integrity and reliable electrical performance in harsh environments.
GORE® SNAPSHOT® EMI Shields are revolutionary, multi-cavity shields that solve many of the problems associated with today’s existing shielding technologies.
The shields consist of a lightweight, metallized plastic material that is thermoformed to virtually any design. The shields are attached to your PCB via a patented attachment mechanism utilizing individual BGA solder spheres. The shields are metallized with tin on the outside surface only, resulting in narrower ground traces, reduced space between components, and reduced shield heights when compared to existing shielding solutions (no air gap needed).